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Microelectronics Packagi…Location:Home - Products - Microelectronics Packaging
  • Zeiss metallographic microscope Axio Imager A2m is the success Axio Imager A1m new upgraded products, optical path design, especially the lighting system on the basis of the Axio Imager A1m superior product performance, new upgrade, the opt…
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  • MRSI is a semi-automatic bonder representing the latest development from American.Incorporating a new ergonomic approach to bonder design, this state-of-the-art platform, with large working area and high placement accuracy, combines applica…
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  • Vacuum sintering furnace are the items to be heated in a vacuum environment protective sintering furnace. Vacuum induction sintering furnace is evacuated, then filled the hydrogen protection status, the use of medium frequency induction hea…
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  • K & S AB530 is mainly used for micro-assembly circuit in the wire bonding binding. Bonding of gold wires between the chips, aluminum and other materials can be used to interconnect.BondheadZ travel 25mm(1inch)Bond Angel 30°Wire diameter…
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