K & S AB530 is mainly used for micro-assembly circuit in the wire bonding binding. Bonding of gold wires between the chips, aluminum and other materials can be used to interconnect.

Bondhead

Z travel                25mm(1inch)

Bond Angel            30°

Wire diameter          20-50μm(0.8-2 mil)

Bond force             Programmable(5-200g)

Bond Power              Programmable(0-1W)

Wire clamp force         Programmable(30-200g)

Cycle time               125ms for 2mm(79mil) wire length

Feed & tear

            Tail length    Programmable

XYθTable

XY travel                  66mm x 66mm(2.6inch x 2.6 inch)

Material Handling System

PCB size                   Max. radius 254mm(10 inch radius)

                           (depends on position of die)

Fine pitch capability @ 1mil wire diameter

Pad size                    63 x 80μm

Pad pitch                   68μm