MRSI is a semi-automatic bonder representing the latest development from American. 

Incorporating a new ergonomic approach to bonder design, this state-of-the-art platform, with large working area and high placement accuracy, combines application modularity within an open hardware and software environment.

Supporting a virtually unlimited field of applications and numerous bonding technologies, the system ensures compatibility with future technologies as users transition from R&D into production.

• Placement accuracy ±5 µm*
• Placement spped 1000UPH
• XY repeatability ±1.5um
• XYZ diatance 508*890*32mm
• XYZ resolution 0.1um,0.1um,0.4um
• Place pressure 10-250g (Option 2000g)
  
• Chip size min 0.008 inch²